Multilayer SMT high power density packaging of electronic ballasts for HID lamps

This paper presents a method for high power density manufacturing of electronic ballast for HID lamps by utilization of a novel SMT stacked converter construction method, Power Sandwich. A two-stage topology of an HID lamp electronic ballast used in a commercial benchmark is employed as a case study. In Power Sandwich technology, new double-sided SMT x-dim components that have uniform height and enhanced thermal properties are stacked between planar substrates to achieve size reduction and better thermal performance of HID lamp ballast. A Power Sandwich prototype of a 150W HID lamp electronic ballast is developed, which has an electrical performance comparable to the commercially available benchmark counterpart but twice as high power density and better thermal performance.