• DocumentCode
    3643108
  • Title

    Scaling of SOI FinFETs down to fin width of 4 nm for the 10nm technology node

  • Author

    J. B. Chang;M. Guillorn;P.M. Solomon;C.-H. Lin;S.U. Engelmann;A. Pyzyna;J. A. Ott;W.E Haensch

  • Author_Institution
    IBM Research, IBM T.J. Watson Research Center, Yorktown Heights, NY, USA
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    12
  • Lastpage
    13
  • Abstract
    Using a novel replacement gate SOI FinFET device structure, we have fabricated FinFETs with fin width (DFin) of 4 nm, fin pitch (FP) of 40 nm, and gate length (LG) of 20 nm. With this structure, we have achieved arrays of thousands of fins for DFin down to 4 nm with robust yield and structural integrity. We observe performance degradation, increased variability, and VT shift as DFin is reduced. Capacitance measurements agree with quantum confinement behavior which has been predicted to pose a fundamental limit to scaling FinFETs below 10 nm LG.
  • Keywords
    "FinFETs","Logic gates","Potential well","Silicon","Quantum capacitance","Capacitance-voltage characteristics"
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2011 Symposium on
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4244-9949-6
  • Electronic_ISBN
    2158-9682
  • Type

    conf

  • Filename
    5984609