Capacitors embedded in photovia substrates

This paper deals with the photolithographic formation of embedded capacitors. The new composite photosensitive dielectric was developed and the whole manufacturing process for this dielectric was specified. The dielectric consists of photopolymer matrix and ceramic filler. The manufacturing process consists of screen printing processes and photolithography. Electrical parameters of manufactured embedded capacitors such as impedance to frequency characteristic or capacitance to filler weight amount characteristic were measured in detail and electrical parameters of embedded capacitors were calculated.