Proposal of the application of the delamination test to semiconductor package design

In molding compound button shear tests, delamination stresses generally are calculated by dividing failure loads by adhesion area of specimens. In general, those delamination stresses can´t be applied to design of products quantitatively. In this study, CAE of button shear test is considered elastic-plastic character of resin. And tensile stresses of interface are evaluated. As a result, the delamination stress which does not be influenced to a test method is acquired.