DocumentCode
3655668
Title
[Title page]
fYear
2015
fDate
6/1/2015 12:00:00 AM
Abstract
The following topics are dealt with: logic technology; reliability; 3D systems and packaging; advanced CMOS technology: Ge FinFET; memory technology; PC RAM; contact-interconnect; ReRAM; nanowire FET; Si FinFET; magnetic tunnel junction; X-on insulator; 3D NAND Flash & other NVM; non-Si substrates: and III-V HEMT-FET-TFET.
Publisher
ieee
Conference_Titel
VLSI Technology (VLSI Technology), 2015 Symposium on
ISSN
0743-1562
Electronic_ISBN
2158-9682
Type
conf
DOI
10.1109/VLSIT.2015.7223621
Filename
7223621
Link To Document