DocumentCode
3667959
Title
Advanced TCAD simulation of local mismatch in 14nm CMOS technology FinFETs
Author
E. M. Bazizi;I. Chakarov;T. Herrmann;A. Zaka;L. Jiang;X. Wu;S. M. Pandey;F. Benistant;D. Reid;A. R. Brown;C. Alexander;C. Millar;A. Asenov
Author_Institution
GLOBALFOUNDRIES, Dresden, Germany
fYear
2015
Firstpage
341
Lastpage
344
Abstract
Local statistical variability (mismatch) is very important in advanced CMOS technologies critically affecting, among others, SRAM supply and holding voltages, performance and yield. TCAD simulation of statistical variability is essential for identification of variability sources and their control in the technology development and optimization. It also plays an important role in the development of accurate statistical compact models for SRAM design, statistical standard cell characterization and statistical circuit simulation and verification. In this paper we compare the TCAD simulation results of statistical variability in 14nm CMOS FinFET technology with Silicon measurements in order to understand the relative role of key statistical variability sources, to assist the technology optimization and to generate target characteristics for statistical compact model extraction.
Keywords
"Semiconductor process modeling","FinFETs","Solid modeling","Integrated circuit modeling","Random access memory","Logic gates","Three-dimensional displays"
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN
1946-1569
Print_ISBN
978-1-4673-7858-1
Type
conf
DOI
10.1109/SISPAD.2015.7292329
Filename
7292329
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