• DocumentCode
    3667959
  • Title

    Advanced TCAD simulation of local mismatch in 14nm CMOS technology FinFETs

  • Author

    E. M. Bazizi;I. Chakarov;T. Herrmann;A. Zaka;L. Jiang;X. Wu;S. M. Pandey;F. Benistant;D. Reid;A. R. Brown;C. Alexander;C. Millar;A. Asenov

  • Author_Institution
    GLOBALFOUNDRIES, Dresden, Germany
  • fYear
    2015
  • Firstpage
    341
  • Lastpage
    344
  • Abstract
    Local statistical variability (mismatch) is very important in advanced CMOS technologies critically affecting, among others, SRAM supply and holding voltages, performance and yield. TCAD simulation of statistical variability is essential for identification of variability sources and their control in the technology development and optimization. It also plays an important role in the development of accurate statistical compact models for SRAM design, statistical standard cell characterization and statistical circuit simulation and verification. In this paper we compare the TCAD simulation results of statistical variability in 14nm CMOS FinFET technology with Silicon measurements in order to understand the relative role of key statistical variability sources, to assist the technology optimization and to generate target characteristics for statistical compact model extraction.
  • Keywords
    "Semiconductor process modeling","FinFETs","Solid modeling","Integrated circuit modeling","Random access memory","Logic gates","Three-dimensional displays"
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-7858-1
  • Type

    conf

  • DOI
    10.1109/SISPAD.2015.7292329
  • Filename
    7292329