• DocumentCode
    3669960
  • Title

    Effects of thermal aging on the characteristic breakdown behavior of Nano-SiO2-BOPP and BOPP films

  • Author

    M. Ritamäki;I. Rytöluoto;K. Lahti;M. Karttunen

  • Author_Institution
    Department of Electrical Engineering, Tampere University of Technology (TUT), Finland
  • fYear
    2015
  • fDate
    7/1/2015 12:00:00 AM
  • Firstpage
    400
  • Lastpage
    403
  • Abstract
    The effects of thermal stress on the breakdown behavior of biaxially oriented polypropylene (BOPP)-silica nanocomposite thin film and commercial BOPP film was evaluated with a step stress experiment in the temperature range of 50...110 °C. Weak spots were measured in thermally aged unfilled BOPP films but not in the PP-silica, which in turn displayed increasing scatter of the breakdown voltages and the scattering seemingly settled to a certain level. No weak spots were measured in un-filled BOPP films removed after highest temperatures. The behavior of un-filled films is speculated to result from either actual polymer aging in addition to the statistical nature of breakdown phenomena or from thermally-activated processes possibly involving antioxidants. The different behavior in the nanocomposite was speculated to result from polymer-nanoparticle interactions possibly countering the effects of antioxidants and hindering weak spot formation. The results demonstrate the different behavior of polymer-nanocomposites and traditional BOPP films under thermal stress and highlight the importance of evaluating the aging behavior of new materials.
  • Keywords
    "Films","Electric breakdown","Temperature measurement","Aging","Dielectric measurement","Stress","Polymers"
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
  • Electronic_ISBN
    2160-9241
  • Type

    conf

  • DOI
    10.1109/ICPADM.2015.7295293
  • Filename
    7295293