Advanced packaging technologies for fully exploiting attributes of WBG power electronics

A set of technical parameters of power electronics package has been employed to characterize the packaging technologies, in order to improve the criteria such as efficiency, cost-effectiveness and reliability of wide bandgap (WBG) power semiconductors in power conversion applications. Some technologies such as integrated gate driver, planar electrical interconnection, and integrated cooling have been developed. The comprehensive improvements in module´s electrical, thermal performance and manufacturability help utilize fully the attributes provided exclusively by the WBG power semiconductors. The technical advancements lead to cost-effective, high efficiency, high power density in automotive electric power conversion systems.