Embedding active and passive components in PCBs and inorganic substrates for power electronics

The Packaging Committee of the Power Sources Manufacturers Association (PSMA) organized and sponsored a special project to study how innovations in 3D packaging either were currently or are projected to be leveraged by the power electronics industry. Phase 1 of this special project resulted in a Technology Report titled “3D Power Packaging” [1] that was prepared under contract by Tyndall Institute of Cork, Ireland and published March 2014. Phase 2 of the special project continued to examine 3D power packaging but with a focus on embedded substrate technologies; it was prepared under contract LTEC Corporation with subcontract to Anagenesis, Inc. and Fraunhofer-Institure and was published March 2015 [2]. The phase 2 report covers a spectrum from active and passive component technologies for embedding, die attach materials and processes, thermal management, and additive manufacturing; however the heart of the report is a chapter on technologies for embedding in PCBs and inorganic substrates. This paper provides an overview of the findings from that report regarding technologies that are currently in production and those forecast to be viable for volume production in the near future.