A novel multipactor suppression method towards high-power microwave switch

It has been a big challenge that breakdown occurs due to multipactor in the high-power antenna system. A novel approach was proposed which introduced porous structure on the surface of microwave components to reduce the secondary emission yield and improve the multipactor threshold. In addition, the simulation method of multipactor was established for the analysis of microwave components with the porous surfaces, which demonstrate reduced secondary emission properties and hence the increased multipactor threshold. Secondary electron emission data of metal samples have been measured under different finishing conditions based on the biased current method. Simulation results of a microwave switch, which is an essential component of the transceiver antenna feed system, show great improvement of the multipactor threshold and match well with the experiment results.