DocumentCode
3677010
Title
External millimeter-wave antenna using spatial coupling for antenna in IC package
Author
Takayoshi Ito;Hideo Kasami
Author_Institution
Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Kanagawa, Japan
fYear
2015
fDate
7/1/2015 12:00:00 AM
Firstpage
2033
Lastpage
2034
Abstract
High-speed short-range wireless communication systems utilizing the 60-GHz band are desired. One candidate for the antenna is Antenna-in-package (AiP) due to its high radiation efficiency compared with Antenna-on-Chip (AoC). The communication distance of AiP is several centimeters. In order to use the same IC package for communication over a distance of several meters, we propose an external millimeter-wave antenna using spatial coupling for AiP. The measured antenna gain of the proposed antenna is increased to 15.4 dBi from -0.6 dBi of AiP at 60.58 GHz without redesigning the IC package. The metal housing shielding the mounting printed circuit board (PCB) reduces the backward radiation while suppressing the effect on the forward radiation.
Keywords
"Antenna measurements","Integrated circuits","Couplings","Metals","Slot antennas","Millimeter wave communication"
Publisher
ieee
Conference_Titel
Antennas and Propagation & USNC/URSI National Radio Science Meeting, 2015 IEEE International Symposium on
Type
conf
DOI
10.1109/APS.2015.7305406
Filename
7305406
Link To Document