• DocumentCode
    3677291
  • Title

    High density integration of Germanium photodiodes on CMOS wafer

  • Author

    S. Malhouitre;P. Grosse;J.M. Hartmann;F. Foumel;M. Wieland;T. van de Peut;C. Kopp

  • Author_Institution
    CEA, LETI, Minatec Campus, Grenoble, France
  • fYear
    2015
  • Firstpage
    61
  • Lastpage
    62
  • Abstract
    Fabrication of high density vertical Germanium photodiodes (PDs) on top of 200 mm CMOS wafers coming from an external foundry is discussed. Optical performances of stand-alone PDs are compared lo those of CMOS-coupled PDs.
  • Keywords
    "CMOS integrated circuits","Photodiodes","Silicon","Bonding","Lithography","Germanium"
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2015 IEEE 12th International Conference on
  • Type

    conf

  • DOI
    10.1109/Group4.2015.7305946
  • Filename
    7305946
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3677291