• DocumentCode
    3684616
  • Title

    Psychological acute stress measurement using a wireless adhesive biosensor

  • Author

    Nandakumar Selvaraj

  • Author_Institution
    Vital Connect Inc., Campbell, CA 95008, USA
  • fYear
    2015
  • Firstpage
    3137
  • Lastpage
    3140
  • Abstract
    Stress management is essential in this modern civilization to maintain one´s stress level low and reduce health risks, since stress is one of the primary causes leading to major chronic health disorders. The present study investigates the validity of stress index (SI) metric that objectively quantifies the psychological acute stress using a disposable adhesive biosensor worn on the chest called as HealthPatch®. Eleven healthy volunteers (n=11) were attached with one HealthPatch sensor at left pectoralis major muscle along the cardiac axis to record modified Lead-II ECG. The subjects carried out a standard Trier Social Stress Test (TSST) protocol. During the study, the subjects filled out state anxiety form-Y1 of the State Anxiety Inventory questionnaire (sSTAI); salivary samples were obtained for salivary alpha-amylase (sAA) and salivary cortisol (sC) measurements; and the HealthPatch sensor data were wirelessly acquired. The data analyses revealed that sSTAI scores were significantly increased (P<;0.001) due to TSST compared to the baseline. But, the changes in both sAA and sC measurements were not significant (P=0.281 and P=0.792, respectively). On the other hand, SI metric of HealthPatch showed significant (P<;0.001) increase (~50%) during TSST, and shown to be sensitive to objectively track acute changes in psychological stress. Thus, HealthPatch biosensor can be valuable for continuous monitoring of psychological health and effective management of stress leading to healthy life.
  • Keywords
    "Stress","Silicon","Speech","Stress measurement","Psychology","Protocols","Biomedical monitoring"
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2015 37th Annual International Conference of the IEEE
  • ISSN
    1094-687X
  • Electronic_ISBN
    1558-4615
  • Type

    conf

  • DOI
    10.1109/EMBC.2015.7319057
  • Filename
    7319057