DocumentCode
3687839
Title
Integration of electronic power components for electromobility
Author
Stephanie Groß;Karin Beart;Thomas Schmidt;Bernhard Schuch
Author_Institution
Continental, Powertrain Division, Business Unit Transmission, Nuremberg, Germany
fYear
2015
Firstpage
1
Lastpage
5
Abstract
The current trend in the global automotive industry toward eco-friendly mobility will continue to grow in the future. At the same time the most important challenge for automotive electronics is to manage increasing electronic power within smaller devices. Power electronic modules have to be placed close to the electric motor or - for hybrid electronic vehicles - close to the combustion engine. Further challenges are to achieve high reliability during operation and to reduce system costs. Under the CATRENE (Cluster for application and technology research in Europe on nanoelectronics) project EmPower (Embedded power components for electric vehicle application), funded by the German government, a new high integrated packaging technology (embedding technology) is under development and being tested which covers power components for electric vehicle applications (e.g. pedelec, electric vehicle).
Keywords
"Insulated gate bipolar transistors","Multichip modules","Substrates","Reliability","Electric vehicles","Automotive engineering"
Publisher
ieee
Conference_Titel
Electric Drives Production Conference (EDPC), 2015 5th International
Print_ISBN
978-1-4673-7511-5
Type
conf
DOI
10.1109/EDPC.2015.7323226
Filename
7323226
Link To Document