DocumentCode
3688986
Title
FinFET versus UTBB SOI — A RF perspective
Author
Jean-Pierre Raskin
Author_Institution
Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Université
fYear
2015
Firstpage
84
Lastpage
88
Abstract
FinFET and Ultra Thin Body and BOX (UTBB) Silicon-on-Insulator (SOI) MOSFETs are the most promising advanced devices to fulfill the International Technology Roadmap for Semiconductors (ITRS) requirements. Both devices have been intensively studied these last years. Most of the reported data concern their digital performance. In this paper, their analog/RF behavior is described and compared. Both show pretty similar characteristics in terms of transconductance, Early voltage, voltage gain, self-heating issue but UTBB outperforms FinFET in terms of cutoff frequencies thanks to their relatively lower fringing parasitic capacitances.
Keywords
"Decision support systems","Yttrium","Hafnium"
Publisher
ieee
Conference_Titel
Solid State Device Research Conference (ESSDERC), 2015 45th European
ISSN
1930-8876
Print_ISBN
978-1-4673-7133-9
Electronic_ISBN
2378-6558
Type
conf
DOI
10.1109/ESSDERC.2015.7324719
Filename
7324719
Link To Document