Integration of Lange Couplers in SiGe BiCMOS technology for RF and mm-Wave applications perspectives for distributed Chip-Package-PCB Co-integration

SiGe BiCMOS design solutions for Lange Couplers operating in the mm-Wave domain are proposed. Various circuit topologies are designed, fabricated, and experimentally compared in terms of their RF performances. Effect of grounding strategies and influence of DTI pattering are studied both for CPS and CPW topologies to evaluate dependence of obtained RF performances on Die back-side grounding strategies. Perspectives for feasibility of distributed Chip-Package-PCB Co-integration of Lange coupler devices are drawn for loss reduction and improved matching to external input sources and antennas.