DocumentCode
3705444
Title
High-speed serial link challenges using multi-level signaling
Author
N. Dikhaminjia;J. He;E. Hernandez;M. Tsiklauri;J. Drewniak;A. Chada;M. Zvonkin;B. Mutnury
Author_Institution
Electromagnetic Compatibility Laboratory, Electrical and Computer Engineering Department, Missouri University of Science and Technology, Rolla, 65401, USA
fYear
2015
Firstpage
57
Lastpage
60
Abstract
The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.
Keywords
"Optical signal processing","Backplanes","Jitter","Modulation","Bandwidth","Decision feedback equalizers","Insertion loss"
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
Print_ISBN
978-1-5090-0038-8
Type
conf
DOI
10.1109/EPEPS.2015.7347129
Filename
7347129
Link To Document