• DocumentCode
    3705448
  • Title

    Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe

  • Author

    Ching-Huei Chen;Ying-Cheng Tseng;Tzong-Lin Wu;I-Chia Lin;Chieh-Chen Fu;Kuo-Hsien Liao

  • Author_Institution
    Department of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan
  • fYear
    2015
  • Firstpage
    77
  • Lastpage
    80
  • Abstract
    This paper presents a fast prediction method to evaluate the near-field shielding effectiveness (SE) for conformal-shielded System-in-Packages (SiP). By revising the typical EM method to meet SiP circumstances, the near-field SE can be quickly estimated. A simple conformal-shielded SiP module is designed. To experimentally verify the proposed method, two kinds of metallic shielding materials, copper and nickel, are sputtered on the module with different coating thicknesses. In the near-field, the measured SE reaches up to 52 dB for 4-μm copper coating as well as 54 dB for 15-μm nickel coating. The predicted results are closely agreed with simulations and measurements from 0.01 and 1 GHz.
  • Keywords
    "Nickel","Copper","Antennas","Semiconductor device measurement","Permeability","Magnetic noise","Magnetic shielding"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
  • Print_ISBN
    978-1-5090-0038-8
  • Type

    conf

  • DOI
    10.1109/EPEPS.2015.7347133
  • Filename
    7347133
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3705448