DocumentCode
3718286
Title
Advanced 3D eWLB-PoP (embedded Wafer Level Ball Grid Array - package on package) technology
Author
Kang Chen;Jose Alvin Caparas;Linda Chua;Yaojian Lin;Seung Wook Yoon
Author_Institution
STATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442
fYear
2015
Firstpage
96
Lastpage
100
Abstract
The advancement of silicon scaling to 14/16 nanometer (nm) in support of higher performance, higher bandwidth and lower power consumption in portable and mobile devices is pushing the boundaries of emerging packaging technologies to smaller fan-out packaging designs with finer line/spacing as well as improved electrical performance and passive embedded technology capabilities. Advanced embedded Wafer Level Ball Grid Array (eWLB) technology provides a versatile platform for the semiconductor industry´s technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations.
Keywords
"Three-dimensional displays","Reliability","Manufacturing","Silicon","Packaging","Vehicles","Surface treatment"
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN
978-1-4673-9690-5
Type
conf
DOI
10.1109/IMPACT.2015.7365174
Filename
7365174
Link To Document