Failure mode investigation of die pick process with high speed camera and numerical analysis

This paper employs a method of measuring the relation between eject pin and UV tape which could cause chip damage during the die bond process. According to the enhancement of LCD technique, lighter, thinner, shorter and smaller has become a sign for the device. Compared with the traditional package, driver IC needs to be designed as a slender shape because of the finite placing space. During die pick process, it can be easily caused damage by the over loaded bending force because of its shape during die bond process. This paper based on passes research experience focus on developing new test for interface strength between UV tape and chip, also the method of filming die bond process with high speed camera. This paper also provided the simple numerical models for UV tape, eject pin and to simulate the interaction of eject pin and UV tape during die bond process.