DocumentCode
3722093
Title
Advanced conformal parylene fabrication for micro/nano devices
Author
Wei Wang;Yaoping Liu;Dongyang Kang;Lingqian Zhang;Yu-Chong Tai
Author_Institution
Institute of Microelectronics, Peking University, Beijing, 100871, China
fYear
2015
Firstpage
1
Lastpage
2
Abstract
Herein, we reported several advanced parylene fabrication techniques for various micro/nano devices by taking advantages of the conformal deposition capability and overcoming related restrictions when depositing in high aspect ratio structures, including deep-trench filling by Parylene C for thermal isolation in silicon microdevices, parylene molding technique for high porosity filter membrane preparation, Parylene C caulked PDMS (pcPDMS) for low permeability microfluidics applications, and ultra-thin parylene deposition for flexible electronics.
Keywords
"Fabrication","Filling","Microchannels","Silicon","Permeability","Microfluidics","Micromechanical devices"
Publisher
ieee
Conference_Titel
SENSORS, 2015 IEEE
Type
conf
DOI
10.1109/ICSENS.2015.7370641
Filename
7370641
Link To Document