• DocumentCode
    3722093
  • Title

    Advanced conformal parylene fabrication for micro/nano devices

  • Author

    Wei Wang;Yaoping Liu;Dongyang Kang;Lingqian Zhang;Yu-Chong Tai

  • Author_Institution
    Institute of Microelectronics, Peking University, Beijing, 100871, China
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Herein, we reported several advanced parylene fabrication techniques for various micro/nano devices by taking advantages of the conformal deposition capability and overcoming related restrictions when depositing in high aspect ratio structures, including deep-trench filling by Parylene C for thermal isolation in silicon microdevices, parylene molding technique for high porosity filter membrane preparation, Parylene C caulked PDMS (pcPDMS) for low permeability microfluidics applications, and ultra-thin parylene deposition for flexible electronics.
  • Keywords
    "Fabrication","Filling","Microchannels","Silicon","Permeability","Microfluidics","Micromechanical devices"
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/ICSENS.2015.7370641
  • Filename
    7370641