DocumentCode
3732350
Title
Secrecy Outage Probability of Two-Path Successive Relaying in Physical Layer Security
Author
Qian Yu Liau;Chee Yen Leow
Author_Institution
Fac. of Electr. Eng., Univ. Teknol. Malaysia, Johor Bahru, Malaysia
fYear
2015
Firstpage
782
Lastpage
786
Abstract
Relaying is a promising technique to improve wireless physical-layer security. Existing literature shows that a full-duplex relay can further improve the secrecy capacity and secrecy outage probability compared to conventional half-duplex relay, but this comes at a price of sophisticated implementation. For sake of easy implementation, two-path successive relaying has been proposed to emulate the full-duplex relay by scheduling a pair of half-duplex relays to assist the source transmission alternately. However, the performance of two-path successive relaying in secrecy communication remains unexplored. This paper proposes a secrecy two-path successive relaying protocol for a scenario with one source, one destination and two half-duplex relays. The relays operate alternately in a time division mode to forward messages continuously from source to destination in the presence of an eavesdropper. To further confuse the eavesdropper, the source and relay are scheduled to transmit jamming signals at appropriate intervals. Analytical results on the secrecy outage probability reveals that the proposed protocol is able to deliver the target secrecy rate when the SNR of the eavesdropping channels are high. In addition, the secrecy outage probability of the proposed protocol is the joint secrecy outage probability of the relay pair. Numerical simulations show that the proposed protocol achieves the highest ergodic secrecy capacity and lowest secrecy outage probability compared to the existing half duplex relaying, full duplex relaying and full duplex jamming schemes.
Keywords
"Relays","Protocols","Jamming","Capacity planning","Interference","Security","Wireless communication"
Publisher
ieee
Conference_Titel
Parallel and Distributed Systems (ICPADS), 2015 IEEE 21st International Conference on
Electronic_ISBN
1521-9097
Type
conf
DOI
10.1109/ICPADS.2015.103
Filename
7384366
Link To Document