Efficient design of thermal management by graphene heat spreader in embedded system

In this paper, a thermal model of an embedded system consisting of MOSFET, MESFET and HFET is presented in Nano-electronic system by using FEM (Finite Element Method). This model is used to analyze the thermal effects of an embedded system and to solve the associated thermal problems by using Graphene heat spreader on different positions of the embedded system. This paper also suggests the best position of graphene heat spreader to ensure maximum reduction of temperature of the electronic devices. As high temperature sets a limit to the reliability of the devices, such modeling is very useful for the optimization of an embedded system to guarantee a longer lifespan and a better reliability.