• DocumentCode
    3748120
  • Title

    GaNFET compact model for linking device physics, high voltage circuit design and technology optimization

  • Author

    Ujwal Radhakrishna;Seungbum Lim;Pilsoon Choi;Tom?s Palacios;Dimitri Antoniadis

  • Author_Institution
    Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
  • fYear
    2015
  • Abstract
    This work is the first demonstration of a physics-based GaN HEMT compact model that is calibrated and verified all the way from individual device-to a HV-buck converter circuit, along with an illustration of use in technology optimization. GaN HEMT based high voltage (HV) switching converters are gaining foothold in the medium voltage (<;1000 V) power conversion applications. The superior breakdown voltage, operating frequency, and high temperature performance of GaN HEMTs enable improved conversion efficiency and smaller footprint of the converters [1]. In order to design such high voltage GaN circuits, the device compact model must accurately describe static and dynamic switching behavior to enable designers to gain insight into the impact of the behavioral nuances of the GaN HEMTs on HV circuit performance, such as non-quasi-statics, which is not possible with the available models such as EEHEMT, Curtice, and Angelov models [2]. The model is validated against DC-IV, -CV, and pulsed-IV measurements of fabricated devices and is then verified by comparing measured and simulated signals in a commercial buck converter. Furthermore we demonstrate that our physics-based model can be used as a device design and multi-dimensional optimization tool to estimate device parameters such as field plate (FP) lengths and FP dielectric thicknesses (td) to maximize the switching figure-of-merit (FoM), BV/RonQg.
  • Keywords
    "Integrated circuit modeling","Logic gates","Temperature measurement","HEMTs","Optimization","Gallium nitride","Capacitance"
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2015 IEEE International
  • Electronic_ISBN
    2156-017X
  • Type

    conf

  • DOI
    10.1109/IEDM.2015.7409664
  • Filename
    7409664