• DocumentCode
    3748267
  • Title

    Efficient metallic carbon nanotube removal for highly-scaled technologies

  • Author

    Max M. Shulaker;Gage Hills;Tony F. Wu;Zhenan Bao;H.-S. Philip Wong;Subhasish Mitra

  • Author_Institution
    Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, U.S.A.
  • fYear
    2015
  • Abstract
    While carbon nanotube (CNT) field-effect transistors (CNFETs) promise to improve the performance and energy efficiency of digital systems beyond the limitations of silicon CMOS, the presence of metallic CNTs (m-CNTs) remains a major challenge. Existing techniques for removing m-CNTs are inadequate, as they face one or more of the following scalability challenges: scaling to large circuits (≥99.99% of m-CNTs must be removed without inadvertently removing semiconducting CNTs, s-CNTs), scaling to short channel lengths (for highly-scaled contacted gate pitch (CPP)), and scaling to small inter-CNT spacing (for high CNT densities required for high CNFET ION). We demonstrate a new m-CNT removal technique that, for the first time, overcomes all of these scalability challenges, as it: (a) removes ≥99.99% of m-CNTs vs. ≤1% of s-CNTs, (b) scales to any arbitrary CPP, and (c) scales to high CNT densities (≥200 CNTs/μm).
  • Keywords
    "CNTFETs","Heating","Logic gates","Delays","Very large scale integration","Digital systems","Plasmas"
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2015 IEEE International
  • Electronic_ISBN
    2156-017X
  • Type

    conf

  • DOI
    10.1109/IEDM.2015.7409815
  • Filename
    7409815