Multilayer thick-film and next generation cost-effective millimetre-wave SoP circuit and system integration techniques

This paper describes the realization of embedded compact and high performance multilayer TFMS-based passives and circuits, substrate integrated waveguides (SIW) and cost effective mounting and integration process, using advanced photoimageable thick-film technology, which offers design flexibility with optimal integration and performance for millimeter-wave (mmW) SOP circuits and systems. The multilayer SIW with trench-fill metal-wall (silver) demonstrates low loss (up to 180 GHz) and is suitable for replacing planar transmission lines for upper mmW and Sub-mmW bands. TFMS multilayer lumped/passive components and circuits show highest performance in MCMs. An efficient mounting and integration technique is used for realizing highly integrated mmW MCMs, integrating MMICs with embedded TFMS lumped filter and SMDs on a single substrate with high performance and compactness.