• DocumentCode
    3750266
  • Title

    Stacking of 3D capacitor dies in a QFN package for a compact and reliable component for medical applications

  • Author

    S. Borel;P. Descours;B. Goubault;M. Pommier;N. David;R. Franiatte;S. Yon;G. Parat;G. Simon;C. Bunel

  • Author_Institution
    Univ. Grenoble Alpes, F-38000 Grenoble, France, CEA, LETI, MINATEC Campus, F-38054 Grenoble, France
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper we present the work that has been carried out to stack 13 dies in a QFN package so as to obtain a super capacitor in a small volume. First the chips technology is described as well as the lead frame. Then the assembly process based on die attach film and wire bonding is explained. Finally the electrical tests of the modules are shown.
  • Keywords
    "Wires","Capacitors","Bonding","Lead","Films","Electrodes","Silicon"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412370
  • Filename
    7412370
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3750266