• DocumentCode
    3750270
  • Title

    3D package failure analysis challenge and solution

  • Author

    Fu Chao;Li Xiaomin;Justin Kow

  • Author_Institution
    WinTech Nano-Technology Services Pte. Ltd.
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    3D packaging with complex multi die and multi component structure has new Failure Analysis challenges in electrical testing, package fault isolation and physical failure analysis. This paper emphasize on new approach using 3D X-Ray other techniques.
  • Keywords
    "Three-dimensional displays","X-ray imaging","Failure analysis","Silicon","Image reconstruction","Electronics packaging","Metals"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412374
  • Filename
    7412374
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3750270