Electrical-thermal co-simulation for large-scale analysis of integrated circuits

An electrical-thermal co-simulation is presented for analysis of integrated circuits. The co-simulation addresses a wide range of situations where strong interactions between electrical designs and thermal issues have to be properly accounted. The capability of the co-simulation is extended to deal with large-scale problems by incorporating a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme. Numerical examples are provided to demonstrate the capability and efficiency of the co-simulation.