• DocumentCode
    3768027
  • Title

    Study on PEG assisted TFA-MOD method for rapid fabrication of YBa2Cu3O7?? thin films: Influence of PEG additive amount in precursor solutions

  • Author

    Wei Wu;Yue Zhao;Zhi Yong Hong;Zhi Jian Jin;Feng Feng;Zheng He Han

  • Author_Institution
    Department of Electrical Engineering, Shanghai Jiaotong University, Shanghai 200240, China
  • fYear
    2015
  • Firstpage
    351
  • Lastpage
    353
  • Abstract
    Superconducting YBa2Cu3O7-δ (YBCO) thin films with critical current density over 4 MA/cm2 (77 K, self field) can be routinely obtained in only 130 min thanks to the polyethylene glycol (PEG) assisted trifluoroacetate metal-organic deposition (TFA-MOD) method. In this study, the amount of PEG2000 additive in the trifluoroacetate based precursor solutions, which has previously been proved to be effective to shorten the heat treatment process, was found to influence the superconducting, mechanical and crystallographic properties of the obtained YBCO thin films in different extent. By tuning the mass fraction of PEG2000 additive (ω) in the precursor solution, it was found that the critical current density (Jc) and the critical temperature (Tc) both had the optimal values when ω was 20-30%. By in-depth analysis of the X-ray diffraction measurement results by Nelson-Riley and Willamson-Hall Methods, the c-axis length, micro-strain of the YBCO films prepared with ω ranging from 0 to 50% could be obtained. It was revealed that the c-axis length and the micro strain of the YBCO films exhibit a similar tendency to that of the critical current density and critical temperature, i. e. their values are optimized when ω was 20-30%.
  • Keywords
    "Yttrium barium copper oxide","Films","Additives","Critical current density (superconductivity)","Strain","Fitting"
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2015 IEEE International Conference on
  • Print_ISBN
    978-1-4673-8106-2
  • Type

    conf

  • DOI
    10.1109/ASEMD.2015.7453608
  • Filename
    7453608