• DocumentCode
    3770614
  • Title

    Electrical evaluation of conductive adhesives

  • Author

    K. F. Schoch;A. I. Bennett

  • Author_Institution
    Dielectrics and Insulation Department, Westinghouse Research and Development Center, Pittsburgh, PA 15235, USA
  • fYear
    1985
  • Firstpage
    291
  • Lastpage
    293
  • Abstract
    The resistivity of several metal-filled adhesives was followed over a frequency range of 1 KHz to 10 MHz. The resistivity of the cured resins increased according to the filler in the order: Ag < Cu < Ni. The resistivity of most of the materials were independent of frequency over the range investigated. The exceptions were the two least conductive materials which decreased in resistivity between 1 MHz and 10 MHz. In addition, the shear strenghts of the adhesives were measured according to ASTM Dl002 on copper surfaces.
  • Keywords
    "Conductivity","Resistance","Nickel","Resins","Compounds","Conductive adhesives"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1985 EIC 17th
  • Print_ISBN
    978-1-5090-3115-3
  • Type

    conf

  • DOI
    10.1109/EIC.1985.7458627
  • Filename
    7458627
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3770614