DocumentCode
3771166
Title
Non-PCB capacitor technology trends
Author
Frank D. Price
Author_Institution
General Electric Capacitor Products Department, Hudson Falls, N.Y. 12839, USA
fYear
1979
Firstpage
243
Lastpage
245
Abstract
After four decades of product design based on a single dielectric liquid, the introduction of non-PCB fluids in 1977 has opened the design limits, economics, and materials for the capacitor design engineer. This paper reviews three major technology changes that are taking place in the capacitor industry involving the use of polypropylene film dielectrics and either vacuum deposited metal or embossed foil electrodes. The significant reduction in energy cost using these new technologies is demonstrated.
Keywords
"Capacitors","Films","Electrodes","Economics","Fluids","Dielectric losses"
Publisher
ieee
Conference_Titel
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN
978-1-5090-3113-9
Type
conf
DOI
10.1109/EIC.1979.7461129
Filename
7461129
Link To Document