DocumentCode
3771474
Title
Embedment stresses — An inexpensive and direct test method
Author
R. E. Isleifson;F. D. Swanson
Author_Institution
Minneapolis Honeywell Reg. Co., Ordnance Division, Plastics Laboratory
fYear
1963
Firstpage
47
Lastpage
50
Abstract
Electronic devices embedded in resin are subject to stresses caused by chemical and thermal shrinkage of the resin. At low temperatures, stresses imparted to embedded components may be high enough to affect the performance of the device. A knowledge of the magnitude of these stresses is important in the selection of an embedment resin for a given application.
Keywords
"Resins","Temperature measurement","Stress","Silicon compounds","Temperature distribution","Glass"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference Materials and Application, 1963 EI
Print_ISBN
978-1-5090-3104-7
Type
conf
DOI
10.1109/EIC.1963.7461740
Filename
7461740
Link To Document