Silicone encapsulants for electronic applications

Silicone dielectric materials, because of their unique properties, are used to improve reliability and to extend the life of electronic components and assemblies where: a. temperatures up to 250C are continuously encountered; b. transient temperatures up to 400 or 500C are encountered; c. repairability or depotting of encapsulated equipment is desirable; d. temperatures down to -70C are encountered; e. size and weight must be reduced; f. dielectric losses at frequencies from dc to 1.0 kcms must be reduced; g. components and assemblies must be protected from moisture; h. components and assemblies must be protected from environmental materials; i. corona is encountreed; j. nuclear radiation is encountered.