Elaboration of Ni/InP contacts: Solid state reactions and associated mechanisms

The metallurgical properties of the Ni/n-InP system have been investigated. We report the formation of a compositionally nonuniform Ni-In-P amorphous layer during the DC sputtering metal deposition process which includes an Ar+ cleaning. During various heat treatments the simultaneous appearance of the Ni₂P and Ni₃P binary phases and the Ni₂InP ternary phase were observed. For temperature equal to or greater than 350°C we highlighted the partition and precipitation of In. Thanks to RTP and longtime annealings we pointed out the predominance of diffusion on the formation of the Ni₂P, Ni₃P and Ni₂InP phases and that of nucleation on the partition and precipitation of In.