Epoxy device bonding and die handling techniques for hybrid microcircuits

Epoxies are quite common commercially, and they can now be used in the assembly of high reliability hybrid microcircuits. The most recent advancements in epoxy technology even permits its use for device bonding in military and spaceflight applications-provided there is adequate documentation of process control. A NASA paper, released in 1972, states: “Epoxy cements of both liquid and dry film types (preforms) produce satisfactory bonds for Classes “A,” “B,” and “C,” spaceflight microcircuit applications.” This use encourages passive chip component attachment with nonconductive epoxies and discourages electrically conductive adhesives in Class “A” circuits until further research can be conducted.