• DocumentCode
    3775357
  • Title

    3D FPGA & 3D ASIC worlds first unified 3D IC design platform

  • Author

    Raminda Madurawe

  • Author_Institution
    Tier Logic, USA
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    16
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation on the three dimensional (3D) FPGA and ASIC unified 3D integrated circuit design platform. Some of the specific topics discussed include: the special features of this unified platform, system specifications and IC design, applications for use; platforms supported; processing capabilities; and targeted markets.
  • Keywords
    "Field programmable gate arrays","Random access memory","Three-dimensional displays","Thin film transistors","ASIC","Integrated circuits"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 22 Symposium (HCS), 2010 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2010.7480079
  • Filename
    7480079
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3775357