Study on model validity of micro-channel flow for high heat flux transmit/receive module cooling

Micro-channel cooling is widely regarded as a promising means of dissipating large steady state heat fluxes in high density electronic device and its sub-systems, such as next generation Transmit/Receive Module. In this paper, various continuum-based slip models are applied to study the low-velocity micro-channel flows, and its validity under different Knudsen numbers are examined by the corresponding experiments and the DSMC method. Our studies have shown that the present slip models are appropriate with the Knudsen number less than 0.15, and the higher order slip conditions improve the predictions with the Knudsen number less than 0.08.