• DocumentCode
    3783026
  • Title

    Modeling contact between rigid sphere and elastic layer bonded to rigid substrate

  • Author

    M. Stevanovic;M.M. Yovanovich;J.R. Culham

  • Author_Institution
    Dept. of Mech. Eng., Waterloo Univ., Ont., Canada
  • Volume
    1
  • fYear
    2000
  • Firstpage
    29
  • Lastpage
    35
  • Abstract
    An approximate mechanical model is developed for predicting the radius of contact between a sphere and a layered substrate. The complex solution of Chen and Engel is reduced to the simple root finding procedure for the unknown contact radius. Numerical data from the model of Chen and Engel are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. Radius predictions show good agreement with experimental measurements.
  • Keywords
    "Bonding","Thermal resistance","Immune system","Thermal conductivity","Contact resistance","Thermal loading","Predictive models","Laplace equations","Resistance heating","Electronic packaging thermal management"
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-5912-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2000.866804
  • Filename
    866804