DocumentCode
3783026
Title
Modeling contact between rigid sphere and elastic layer bonded to rigid substrate
Author
M. Stevanovic;M.M. Yovanovich;J.R. Culham
Author_Institution
Dept. of Mech. Eng., Waterloo Univ., Ont., Canada
Volume
1
fYear
2000
Firstpage
29
Lastpage
35
Abstract
An approximate mechanical model is developed for predicting the radius of contact between a sphere and a layered substrate. The complex solution of Chen and Engel is reduced to the simple root finding procedure for the unknown contact radius. Numerical data from the model of Chen and Engel are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. Radius predictions show good agreement with experimental measurements.
Keywords
"Bonding","Thermal resistance","Immune system","Thermal conductivity","Contact resistance","Thermal loading","Predictive models","Laplace equations","Resistance heating","Electronic packaging thermal management"
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-5912-7
Type
conf
DOI
10.1109/ITHERM.2000.866804
Filename
866804
Link To Document