Efficient broadband analysis of microwave components

Continuous advances in microwave integration technology allow the construction of cost-effective, high-density, multilayered, system-on-a-chip solutions for RF and stand alone microwave components. This article demonstrates the applicability of FFT-accelerated time-domain integral equation solvers to the broadband analysis of several microwave components, viz., a stub filter and a multilayered LTCC (low temperature cofired ceramic) inductor. These devices´ scattering parameters are extracted over a band of frequencies following Fourier transformation. The approach used is sufficiently general to be extended to the analysis of other quasi-planar, multilayered structures such as transmission lines, capacitors, and microstrip antennas.