• DocumentCode
    381347
  • Title

    Advanced solar tile design and performance

  • Author

    Flora, Craig ; Bauman, Scott

  • Author_Institution
    Ball Aerosp. & Technol. Corp., Boulder, CO, USA
  • Volume
    5
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    193336
  • Abstract
    Unlike typical solar arrays whereby each string is composed of solar cells with discrete coverslides and interconnects, a solar tile contains a complete string, or multiple strings, under a single coverslide with coplanar contact solar cells mounted to and interconnected with Kapton®-copper flexible circuitry. Advance fabrication processes include robotic solar cell placement, vapor-phase batch soldering, and laser formed circuit vias. This design and manufacturing approach increases cell packing factor, improves plasma charge tolerance, reduces fabrication variability, simplifies tooling, and allows creation of compact strings for improved array shadow performance. Besides typical solar array applications, the solar tile approach is well suited for high voltage applications and those requiring high magnetic cleanliness. Full scale, 11"×14", electrical tiles have be fabricated with both coplanar dual-junction and triple-junction solar cells.
  • Keywords
    flexible structures; solar cell arrays; soldering; space vehicle power plants; 11 inch; 14 inch; array shadow performance; cell packing factor; coplanar contact solar cells; coverslide; dual-junction solar cells; electrical tiles; fabrication variability; flexible circuitry; high voltage applications; laser formed circuit vias; magnetic cleanliness; multiple strings; plasma charge tolerance; robotic solar cell placement; solar tile design; tooling; triple-junction solar cells; vapor-phase batch soldering; Flexible printed circuits; Integrated circuit interconnections; Manufacturing; Optical device fabrication; Photovoltaic cells; Plasma applications; Plasma materials processing; Robots; Soldering; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference Proceedings, 2002. IEEE
  • Print_ISBN
    0-7803-7231-X
  • Type

    conf

  • DOI
    10.1109/AERO.2002.1035417
  • Filename
    1035417