DocumentCode
381818
Title
Micro-electromechanical systems and test results of SiC MEMS for high-g launch applications
Author
Katulka, Gary L.
Author_Institution
U.S. Army Res. Lab., APG, MD, USA
Volume
2
fYear
2002
fDate
2002
Firstpage
1134
Abstract
Micro-electromechanical systems or MEMS are typically used for the measurement of physical phenomena associated with gun launched projectiles and other smart munitions. These devices generally experience not only the harsh environment encountered during initial shock and vibration at gun launch, but also the extremes of high temperature, high pressure and in some cases large electromagnetic fields associated with the launching mechanisms. This paper describes the various types of sensor requirements and characteristics for modern smart weapons, especially those of MEMS and in particular recent experimental results with silicon carbide MEMS pressure sensors.
Keywords
intelligent sensors; intelligent structures; microsensors; pressure sensors; projectiles; silicon compounds; weapons; wide band gap semiconductors; MEMS; SiC; electromagnetic fields; gun launched projectiles; harsh environment; high-g launch applications; micro-electromechanical systems; pressure; pressure sensors; shock; smart munitions; temperature; vibration; Electric shock; Electromagnetic measurements; Intelligent sensors; Microelectromechanical systems; Micromechanical devices; Projectiles; Sensor phenomena and characterization; Silicon carbide; System testing; Weapons;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2002. Proceedings of IEEE
Print_ISBN
0-7803-7454-1
Type
conf
DOI
10.1109/ICSENS.2002.1037273
Filename
1037273
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