• DocumentCode
    381818
  • Title

    Micro-electromechanical systems and test results of SiC MEMS for high-g launch applications

  • Author

    Katulka, Gary L.

  • Author_Institution
    U.S. Army Res. Lab., APG, MD, USA
  • Volume
    2
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    1134
  • Abstract
    Micro-electromechanical systems or MEMS are typically used for the measurement of physical phenomena associated with gun launched projectiles and other smart munitions. These devices generally experience not only the harsh environment encountered during initial shock and vibration at gun launch, but also the extremes of high temperature, high pressure and in some cases large electromagnetic fields associated with the launching mechanisms. This paper describes the various types of sensor requirements and characteristics for modern smart weapons, especially those of MEMS and in particular recent experimental results with silicon carbide MEMS pressure sensors.
  • Keywords
    intelligent sensors; intelligent structures; microsensors; pressure sensors; projectiles; silicon compounds; weapons; wide band gap semiconductors; MEMS; SiC; electromagnetic fields; gun launched projectiles; harsh environment; high-g launch applications; micro-electromechanical systems; pressure; pressure sensors; shock; smart munitions; temperature; vibration; Electric shock; Electromagnetic measurements; Intelligent sensors; Microelectromechanical systems; Micromechanical devices; Projectiles; Sensor phenomena and characterization; Silicon carbide; System testing; Weapons;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2002. Proceedings of IEEE
  • Print_ISBN
    0-7803-7454-1
  • Type

    conf

  • DOI
    10.1109/ICSENS.2002.1037273
  • Filename
    1037273