Thick-film hybrid technology for low output voltage DC/DC converter

Author

Pernía, Alberto M. ; Prieto, Miguel J. ; Lopera, Juan M. ; Reilly, John ; Linton, Samuel S. ; Quiñones, Carlos

Author_Institution

Grupo de Electronica Ind., Univ. de Oviedo, Gijon, Spain

Volume

2

fYear

2002

fDate

13-18 Oct. 2002

Firstpage

1315

Abstract

The new requirements in portable and telecommunication equipment also affects the supply systems. The current tendency to reduce the output voltage (3.3, 2.7 V DC) together with the necessity of an important size reduction is modifying the strategies for DC/DC converter implementation. Low-voltage, high-power-density applications present two important factors that must be analysed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W DC/DC buck converter with passive integration using hybrid technology. As a result of the mentioned integration technique, a power density of 6.25 W/cm/sup 3/ was obtained with high efficiency (90% approx.).

Keywords

DC-DC power convertors; capacitors; inductors; telecommunication power supplies; thermal analysis; thermal management (packaging); thick film circuits; 10 W; 2.7 V; 3.3 V; buck converter; capacitor design; high currents; high-power-density; high-power-density converters; inductor design; low output voltage DC/DC converter; output voltage reduction; passive integration; portable equipment; supply systems; telecommunication equipment; thermal problems; thick-film hybrid technology; Buck converters; Capacitors; Communication industry; DC-DC power converters; Diodes; Frequency; Low voltage; Magnetic devices; Substrates; Topology;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 2002. 37th IAS Annual Meeting. Conference Record of the

Conference_Location

Pittsburgh, PA, USA

ISSN

0197-2618

Print_ISBN

0-7803-7420-7

Type

conf

DOI

10.1109/IAS.2002.1042728

Filename

1042728