• DocumentCode
    385811
  • Title

    Low Cost MMIC Insertion Using Thick Film Processing

  • Author

    Bettner, A. ; Hundley, B. ; Salisbury, P.

  • Volume
    87
  • Issue
    1
  • fYear
    1987
  • fDate
    31929
  • Firstpage
    131
  • Lastpage
    133
  • Abstract
    Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.
  • Keywords
    Capacitors; Costs; Glass; MMICs; Microwave integrated circuits; Nonhomogeneous media; Power transmission lines; Resistors; Thick film circuits; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter-Wave Monolithic Circuits
  • Type

    conf

  • DOI
    10.1109/MCS.1987.1114532
  • Filename
    1114532
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=385811