• DocumentCode
    3861210
  • Title

    Use of electromagnetic simulation for signal integrity analysis of TFT interfaces in automotive human machine interface systems

  • Author

    Lin Biao Wang;Fook Wai Lee;Wai Kin Chua;Eng Kee Chua

  • Author_Institution
    Continental Automotive Singapore, Singapore
  • Volume
    4
  • Issue
    4
  • fYear
    2015
  • Firstpage
    51
  • Lastpage
    56
  • Abstract
    This article discusses about the use of electromagnetic (EM) simulation for signal integrity (SI) design on the interface to a thin film transistor (TFT) display used in automotive human-machine- interface (HMI) cluster. As the display size increases, so does the operating frequency of the display. With that, signal integrity (SI) simulation has become an integral part of automotive design. In order to perform an SI analysis of such interface, information of the printed circuit board (PCB) and flexible printed circuit (FPC) cable are required. Hence, a brute force approach of simulation and analysing such interface is time-consuming. Given the iterative nature of such design work, this has significant impact on the time to market. In this paper, several key methods to reduce computational effort is discussed and evaluated. This includes the use of equivalent circuit models, different modelling methods for the PCB and FPC, and models conversion. A practical example is demonstrated using the various co-simulation approaches to achieve fast SI analysis without compromising on its accuracy.
  • Keywords
    "Thin film transistors","Integrated circuit modeling","Silicon","Automotive engineering","Analytical models","Electromagnetics","Capacitors"
  • Journal_Title
    IEEE Electromagnetic Compatibility Magazine
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2015.7407179
  • Filename
    7407179