• DocumentCode
    3861930
  • Title

    Modeling contact between rigid sphere and elastic layer bonded to rigid substrate

  • Author

    M. Stevanovic;M.M. Yovanovich;J.R. Culham

  • Author_Institution
    C-MAC Eng., Ottawa, Ont., Canada
  • Volume
    24
  • Issue
    2
  • fYear
    2001
  • Firstpage
    207
  • Lastpage
    212
  • Abstract
    An approximate mechanical model is developed for predicting the radius of contact between a sphere and a layered substrate. The complex solution of Chen and Engel is reduced to the simple root finding procedure for the unknown contact radius. Numerical data from the model of Chen and Engel are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. Radius predictions show good agreement with experimental measurements.
  • Keywords
    "Bonding","Thermal resistance","Thermal conductivity","Immune system","Contact resistance","Electronic packaging thermal management","Resistance heating","Predictive models","Electrical resistance measurement","Thermal stresses"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.926384
  • Filename
    926384