DocumentCode
3861930
Title
Modeling contact between rigid sphere and elastic layer bonded to rigid substrate
Author
M. Stevanovic;M.M. Yovanovich;J.R. Culham
Author_Institution
C-MAC Eng., Ottawa, Ont., Canada
Volume
24
Issue
2
fYear
2001
Firstpage
207
Lastpage
212
Abstract
An approximate mechanical model is developed for predicting the radius of contact between a sphere and a layered substrate. The complex solution of Chen and Engel is reduced to the simple root finding procedure for the unknown contact radius. Numerical data from the model of Chen and Engel are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. Radius predictions show good agreement with experimental measurements.
Keywords
"Bonding","Thermal resistance","Thermal conductivity","Immune system","Contact resistance","Electronic packaging thermal management","Resistance heating","Predictive models","Electrical resistance measurement","Thermal stresses"
Journal_Title
IEEE Transactions on Components and Packaging Technologies
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.926384
Filename
926384
Link To Document