DocumentCode
393304
Title
Ultrasonic evaluation of thermally shocked Cr3C2/Al2O3
Author
Shih-Jeh Wu ; Jow-Lay Huang
Author_Institution
Dept. of Mech. Eng., I-Shou Univ., Kaohsiung, Taiwan
Volume
1
fYear
2002
fDate
8-11 Oct. 2002
Firstpage
873
Abstract
Chromium carbide (Cr3C2) has been proved to be a potential material for toughening alumina in biomedical and industrial applications because of its high Young´s modulus and erosion resistance. On the other hand, TiC/Al2O3 composite has been used a magnetic head slider due to its good wear resistance and mechanical strength. In this study we prepare samples of Cr3C2/Al2O3 composite by injection moulding method. To use this ceramic material as structural components when the temperature varies rapidly, it is necessary to be able to estimate damage or thermal shock cracking. Ultrasonic attenuation measurements are made for assessment of thermal shock damage. Results show that the attenuation increases as the shock temperature raises. Corresponding SEM pictures show although the size of micro-crack doesn´t change the depth of the micro-cracks increases. It is demonstrated that ultrasonic attenuation proves to be a reliable tool for evaluating micro-fractures in solids.
Keywords
alumina; ceramics; chromium compounds; composite materials; crack detection; scanning electron microscopy; thermal stress cracking; ultrasonic absorption; ultrasonic materials testing; wear resistance; Cr3C2-Al2O3; SEM; biomedical applications; ceramic material; erosion resistance; high Young´s modulus; industrial applications; injection moulding method; micro-crack; micro-fractures; structural components; thermal shock cracking; thermally shocked Cr3C2/Al2O3; toughening alumina; ultrasonic attenuation; Attenuation; Biological materials; Biomedical materials; Chromium; Electric shock; Immune system; Magnetic heads; Magnetic materials; Metals industry; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
ISSN
1051-0117
Print_ISBN
0-7803-7582-3
Type
conf
DOI
10.1109/ULTSYM.2002.1193536
Filename
1193536
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