DocumentCode
400934
Title
Dopant ion induced electron emission yield from IC target materials
Author
Arrale, A.M. ; Zhao, Z.Y. ; Cherekdjian, S.
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
575
Lastpage
578
Abstract
While ion induced electrons have a well-documented physical application in various areas, they can be a nuisance in a lot of others such as the absolute current measuring devices of ion implanters. Furthermore, electrons released from insulated sections of device wafers bombarded by positive dopant ions can enhance the positive charge buildup thus causing catastrophic breakdowns of gate oxides. Therefore, it is important to know the electron emission yield of those materials so that a proper means of suppressing them or compensating the induced charges is performed. We present the electron emission yield as a function of energy from single crystal silicon, polysilicon and SiO2 targets induced by dopant (B, P, As) ions that are commonly used in the silicon IC industry. The ion induced electron emission yield results from these targets will be compared and discussed. The electronic stopping powers and the corresponding material parameters are also calculated.
Keywords
arsenic; boron; electron emission; elemental semiconductors; ion implantation; ion-surface impact; phosphorus; semiconductor doping; silicon; silicon compounds; As; B; IC target materials; P; Si; SiO2; SiO2 targets; absolute current measuring devices; device wafers; dopant ion induced electron emission yield; ion implanters; polysilicon; positive charge buildup; positive dopant ions; single crystal Si; Atomic measurements; Crystalline materials; Current measurement; Electric breakdown; Electron emission; Implants; Insulation; Projectiles; Silicon; Surface charging;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1258070
Filename
1258070
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