• DocumentCode
    405744
  • Title

    Moving forward: the power challenge

  • Author

    Kawa, Jacek

  • Author_Institution
    Adv.Technol. Group, Synopsys Inc., Mountain View, CA, USA
  • Volume
    1
  • fYear
    2003
  • fDate
    21-24 Oct. 2003
  • Abstract
    DSM has allowed integrated desktop and portable applications in computing and telecommunications to operate at very high frequencies-dissipating a lot of power in a relatively small area. Unfortunately these fast devices are leaky! Power dissipation technologies (packages, fans, etc.) are expensive, and, battery technology could not keep up with the added demand of hand-held devices for power. Also, high frequencies coupled With high densities have created localized high power densities that posed an integrity issue in chips even when overall power dissipation was not excessive. Power budgeting and low power circuit and software techniques are at the forefront of system design. This tutorial will cover the power challenge and propose useful solutions.
  • Keywords
    demand side management; integrated circuit design; system-on-chip; DSM; SOC; battery technology; demand side management; hand held devices; high frequency operation; high power density; integrated circuit design; integrated desktop application; low power circuit; portable application; power dissipation technologies; software techniques; system design; system-on-chip; telecommunication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2003. Proceedings. 5th International Conference on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7889-X
  • Type

    conf

  • DOI
    10.1109/ICASIC.2003.1277484
  • Filename
    1277484