DocumentCode
405744
Title
Moving forward: the power challenge
Author
Kawa, Jacek
Author_Institution
Adv.Technol. Group, Synopsys Inc., Mountain View, CA, USA
Volume
1
fYear
2003
fDate
21-24 Oct. 2003
Abstract
DSM has allowed integrated desktop and portable applications in computing and telecommunications to operate at very high frequencies-dissipating a lot of power in a relatively small area. Unfortunately these fast devices are leaky! Power dissipation technologies (packages, fans, etc.) are expensive, and, battery technology could not keep up with the added demand of hand-held devices for power. Also, high frequencies coupled With high densities have created localized high power densities that posed an integrity issue in chips even when overall power dissipation was not excessive. Power budgeting and low power circuit and software techniques are at the forefront of system design. This tutorial will cover the power challenge and propose useful solutions.
Keywords
demand side management; integrated circuit design; system-on-chip; DSM; SOC; battery technology; demand side management; hand held devices; high frequency operation; high power density; integrated circuit design; integrated desktop application; low power circuit; portable application; power dissipation technologies; software techniques; system design; system-on-chip; telecommunication;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC, 2003. Proceedings. 5th International Conference on
ISSN
1523-553X
Print_ISBN
0-7803-7889-X
Type
conf
DOI
10.1109/ICASIC.2003.1277484
Filename
1277484
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