• DocumentCode
    405801
  • Title

    Fast extraction of 3-D interconnect resistance: numerical-analytical coupling method

  • Author

    Xiren Wang ; Wenjian Yu ; Zeyi Wang

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • Volume
    1
  • fYear
    2003
  • fDate
    21-24 Oct. 2003
  • Firstpage
    315
  • Abstract
    Fast and accurate parasitic parameter extraction becomes more and more important for VLSI design. In this paper, a fast and accurate method is presented to extract three-dimensional interconnect resistance. In this method, the whole resistance region is firstly cut into regular parts and irregular parts. The resistance extraction of these two kinds of parts is solved using the analytical formula and the numerical method of 3-D boundary element method respectively. Experiments on real layout cases show that, compared with the commercial software Raphael and the method of 3-D BEM without analytical method coupled, the proposed analytical-numerical coupling method has a speedup of more than 2000 and 40 respectively while preserving high accuracy.
  • Keywords
    VLSI; boundary-elements methods; electric resistance; integrated circuit design; integrated circuit interconnections; 3D BEM; 3D boundary element method; 3D interconnect resistance extraction; VLSI design; commercial software Raphael; numerical-analytical coupling; parasitic parameter extraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2003. Proceedings. 5th International Conference on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7889-X
  • Type

    conf

  • DOI
    10.1109/ICASIC.2003.1277551
  • Filename
    1277551