DocumentCode
405801
Title
Fast extraction of 3-D interconnect resistance: numerical-analytical coupling method
Author
Xiren Wang ; Wenjian Yu ; Zeyi Wang
Author_Institution
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Volume
1
fYear
2003
fDate
21-24 Oct. 2003
Firstpage
315
Abstract
Fast and accurate parasitic parameter extraction becomes more and more important for VLSI design. In this paper, a fast and accurate method is presented to extract three-dimensional interconnect resistance. In this method, the whole resistance region is firstly cut into regular parts and irregular parts. The resistance extraction of these two kinds of parts is solved using the analytical formula and the numerical method of 3-D boundary element method respectively. Experiments on real layout cases show that, compared with the commercial software Raphael and the method of 3-D BEM without analytical method coupled, the proposed analytical-numerical coupling method has a speedup of more than 2000 and 40 respectively while preserving high accuracy.
Keywords
VLSI; boundary-elements methods; electric resistance; integrated circuit design; integrated circuit interconnections; 3D BEM; 3D boundary element method; 3D interconnect resistance extraction; VLSI design; commercial software Raphael; numerical-analytical coupling; parasitic parameter extraction;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC, 2003. Proceedings. 5th International Conference on
ISSN
1523-553X
Print_ISBN
0-7803-7889-X
Type
conf
DOI
10.1109/ICASIC.2003.1277551
Filename
1277551
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